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IPC-9797 (Juin 2020) Press-fit Standard for Automotive Requirements and other High-Reliability Applications IPC-9797 is the only industry-consensus standard for Requirements and Acceptance of Press-fit Pins. IPC-9797 prescribes practices for the characterization, qualification and acceptance requirements of compliant press-fit technology for printed boards that cover the manufacturability and reliability needs for high reliability applications intended for use in harsh environments such as automotive and aerospace. 52 pages. Langue : Anglais

IPC-1755A (Avril 2020) Responsible Sourcing of Minerals Data Exchange Standard The IPC-1755A standard establishes the requirements for exchanging data between suppliers and their customers in regard to the responsbile resourcing of minerals. The IPC-1755As standard originally addressed conflict minerals within the scope of the Dodd-Frank Act in the US. IPC-1755A expands the scope of this document to address global responsbile minerals sourcing. 44 pages. Langue : Anglais

IPC-4101E WAM1 (Avril 2020) Specification for Base Materials for Rigid and Multilayer Printed Boards IPC-4101E-WAM1 covers the requirements for base materials that are referred to as laminate or prepreg and listed in the specification sheets which are found after the main body of the standard. The specification sheets are to be used primarily for rigid and multilayer printed boards for electronic interconnections. The IPC-4101E-WAM1 standard contains 70 individual specification sheets that can be searched using keywords. The keywords allow users to find materials of a similar nature, but with specific differing properties that fine-tune their laminate and/or prepreg selection needs. The IPC-4101E-WAM1 includes an Appendix A that provides supplemental inspection requirements, but only if required in the material user’s purchase order or master drawing. 176 pages. Langue : Anglais

IPC-1602 (Avril 2020) Standard for Printed Board Handling and Storage The IPC-1602 standard provides requirements intended to protect printed boards from contamination, physical damage, solderability degradation and moisture uptake. Consideration is given to packaging materials types and methods, production environment, handling and transport of product, and establishing baking profiles for moisture removal. IPC-1602 is now providing requirements that can be called out within procurement documentation. The IPC-1602 standard provides expanded coverage of moisture barrier bags (MBBs), the impact of baking on printed board solderability, ESD issues, moisture concerns for etched cores and composites, desiccant material and HIC cards, and example of flow downs of packaging and handling requirements. 36 pages. Langue : Anglais

IPC-J-STD-001GA/A-610GA (Mars 2020) Automotive Addendum to IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610G Acceptability of Electronic Assemblies The IPC J-STD-001GA/IPC-A-610GA automotive addendum to J-STD-001G and IPC-A-610G provides criteria to ensure the reliability of mission-critical soldered automotive electrical and electronic assemblies in the field under harsh environments and considers the conditions of automated high-volume production. The IPC J-STD-001GA/IPC-A-610GA addendum is not a standalone document. The addendum requires it be used in conjunction with J-STD-001G and IPC-A-610G as they are used to look at the whole of the electronics assembly manufacturing process from assembly to inspection to address board reliability requirements for the automotive industry. 137 pages. Langue : Anglais

IPC J-STD-001GS AM 1 (Mars 2020) Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies The IPC J-STD-001GS AM 1 amendment to the IPC J-STD-001GS space addendum supplements or replaces specifically identified requirements of IPC J-STD-001G for the cleaning requirements for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space and military applications. 16 pages. Langue : Anglais

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